The results show that with increase of machining distance pore becomes smaller and then closes due to machining-induced compressive stress, resulting in low material damage and strong structure stability. In this investigation, we establish an analytical model for pore healing, and provide a criteria to determine whether or not pore can be healed. The subsurface damage and surface integrity of a spherical diamond indenter sliding against a face-centred cubic copper (100) surface considering the pore and second-phase particle effects is investigated by means of molecular dynamic simulations of nanoindentation followed by nanomachining.
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